• ALP681F
  • ALP681F
  • ALP681F
  • ALP681F
  • ALP681F
  • ALP681F
  • ALP681F
  • ALP681F
  • ALP681F
  • ALP681F

ALP681F

Leetop_ALP_681_F is an embedded artificial intelligencecomputer developed based on the NVIDIA AGX Orin core boardwhich can provide computing power up to 200/275TOPS formany terminal devices. Leetop_ALP_681_F provides a fast activecooling design, which can meet industrial standards such asshock resistance and anti-static.At the same time.Leetop_ALP_681_F has rich interfaces and high cost performance.
  • ALP681F
  • ALP681F
  • ALP681F
  • ALP681F
  • ALP681F

SPECIFICATION

processor module

specifications
Module Nvidia Jetson AGX Orin 32GB Nvidia Jetson AGX Orin 64GB
AI Performance 200 TOPS 275 TOPS
CPU 1792-core NVIDIA Ampere GPU with 56 Tensor Cores 2048-core NVIDIA Ampere GPU with 64 Tensor Cores
GPU 8-core NVIDIA Arm® Cortex A78AE v8.2 64- bit CPU 2MB L2 + 4MB L3 12-core NVIDIA Arm® Cortex A78AE v8.2 64- bit CPU 3MB L2 + 6MB L3
Memory 32 GB 256-bit LPDDR5 204.8 GB/s 64GB 256-bit LPDDR5 204.8 GB/s
Storage 64GB eMMC 5.1
Video Encode 1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) 2x 4K60 4x 4K30 8x 1080p60 16x 1080p30 (H.265) 2x 4K60 4x 4K30 7x 1080p60 15x 1080p30 (H.264)
Video Decode 1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) 1x 8K30 3x 4K60 6x 4K30 12x 1080p60 24x 1080p30 (H.265) 1x 4K60 3x 4K30 7x 1080p60 14x 1080p30 (H.264)
Power 15W - 40W 15W - 60W

interface I/O

interface Specifications
DC Power supply interface
Display 1 x HDMI
USB 4x USB 3.0 Type A (Integrated USB 2.0) 1x USB 2.0+ 3.0 (TYPE C)
Network 1x Gigabit Ethernet (10/100/1000) 1xGigabit Ethernet (10G)
SIM_Card 1xSIM_Card
GMSL 2xGMSL
TF_Card 1xTF_Card
Function key 1xPower ;1xRESET ;1xRecovery

Power Supply

Power Supply Spec
Input Voltage +12(16A)---+36V(140W) DC Input
Power consumption 90W

Mechanical

Mechanical Spec
Dimensions (W×D ×H) 224X175X65.4(mm)
Weight 2.8KG

Environmental

Environmental Spec
Operating Temperature -20℃-70℃ 0.2~0.3m/s Turbulence
Storage Temperature -20℃-60℃
Storage Humidity 10%-90% non-condensing

Schematic diagram of dimensions

Front view Left view
Up view Rear view

Matching table

Product name Core module SSD communication power
ALP_681_F
J1:AGX Orin(32G)
J2:AGX Orin(64G)
N
128G
256G
512G
1T
N
4G
5G
N
01:Ming Wai
02:Customisation
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